제품 상세정보
원래 장소: 중국
브랜드 이름: ZMSH
인증: rohs
모델 번호: 레이저 분리 시스템 기계
지불 및 배송 조건
최소 주문 수량: 5
가격: by case
배달 시간: 3-6개월
지불 조건: T/T
공급 능력: 한달에 1000PCS
레이저 유형: |
Excimer (193nm/248nm), 펨토초 (343nm/1030nm) |
처리 영역: |
최대 150mm × 150mm |
처리 속도: |
50–300mm/s |
리프트 오프 두께: |
10nm – 20μm |
시스템 통합: |
EFU 청정 장치, 배기 가스 처리 시스템 |
애플리케이션: |
반도체 제조, 유연한 전자 장치 |
레이저 유형: |
Excimer (193nm/248nm), 펨토초 (343nm/1030nm) |
처리 영역: |
최대 150mm × 150mm |
처리 속도: |
50–300mm/s |
리프트 오프 두께: |
10nm – 20μm |
시스템 통합: |
EFU 청정 장치, 배기 가스 처리 시스템 |
애플리케이션: |
반도체 제조, 유연한 전자 장치 |
6-12 Inch 1064nm SiC Substrate Laser Separation System Machine Wafers Customized
The Laser Lift-Off (LLO) System is an advanced precision processing technology that utilizes high-energy pulsed lasers to achieve selective material separation at interfaces. This technology is widely applied in semiconductor manufacturing, flexible electronics, optoelectronic devices, and energy sectors. Its core advantages include non-contact processing, high-resolution control, and multi-material compatibility, making it indispensable for applications such as MicroLED mass transfer, flexible display fabrication, and semiconductor wafer-level packaging.
Company Service Highlights:
Customized Solutions: Tailored laser wavelength (193nm–1064nm), power (1W–100W), and automation integration to support R&D and mass production.
Process Development: Laser parameter optimization, beam shaping design, and validation services (e.g., UV laser LLO for sapphire substrates).
Smart Maintenance: Integrated remote monitoring and fault diagnosis, ensuring 24/7 operational support with <2-hour response time.
| Parameter | Typical Values | Notes |
| Laser Type | Excimer (193nm/248nm), Femtosecond (343nm/1030nm) | Pulse width 5–20ns, peak power >10kW |
| Processing Area | Max 150mm × 150mm | Multi-station parallel processing |
| Processing Speed | 50–300mm/s | Adjustable per material and laser power |
| Lift-Off Thickness | 10nm–20μm | Layer-by-layer delamination capability |
| System Integration | EFU clean unit, exhaust gas treatment system | ISO 14644 cleanliness compliance |
LLO operates through selective ablation at material interfaces:
Laser Irradiation: High-energy pulses (e.g., excimer or femtosecond lasers) focus on the target interface (e.g., sapphire-GaN), inducing photothermal/photochemical reactions.
Interface Decomposition: Laser energy triggers gasification (e.g., GaN → Ga + N₂), generating plasma and thermal stress for controlled delamination.
Material Collection: Delaminated microstructures are captured via vacuum suction or fluid dynamics, ensuring contamination-free transfer.
Key Technologies:
| Feature | Technical Specifications | Applications |
| Non-contact Processing | Laser energy transmitted via optics, avoiding mechanical stress on fragile materials | Flexible OLED, MEMS |
| High Precision | Positioning accuracy ±0.02mm, energy density control ±1% | MicroLED transfer, sub-μm patterning |
| Multi-material Compatibility | Supports UV (CO₂), visible (green), and IR lasers; compatible with metals, ceramics, polymers | Semiconductors, medical devices, renewables |
| Intelligent Control | Integrated machine vision, AI-driven parameter optimization, automated loading/unloading | 30%+ production efficiency improvement |
1. Semiconductor Manufacturing
2. Flexible Electronics
3. Medical Devices
4. Renewables
1. Q: What is a laser lift-off system?
A: A laser lift-off system is a precision processing tool that uses high-energy pulsed lasers to selectively separate materials at interfaces, enabling applications like MicroLED mass transfer and flexible electronics manufacturing .
2. Q: What industries use LLO systems?
A: LLO systems are critical in semiconductor manufacturing (wafer-level packaging), flexible electronics (foldable displays), medical devices (sensor fabrication), and renewables (solar cells), offering non-contact, high-resolution processing .
Tags: #6-12 Inch, #1064nm, # SiC Substrate Laser Separation System Machine, #Wafers Customized
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