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4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer
  • 4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer
  • 4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer
  • 4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer
  • 4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer

4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer

Place of Origin China
브랜드 이름 ZMSH
Model Number SiC Substrate
제품 상세정보
Material:
SiC Single Crystal
Type:
4H-N type
Thickness:
350um 500um
Density:
3.21 G/cm3
Surface:
Si-face CMP; C-face Mp;
Wafer Orientation:
On axis: <0001> +/- 0.5 deg
제품 설명

SiC wafer, Silicon Carbide Wafer, SiC Substrate, Silicon Carbide Substrtge, P Grade, D Grade, 2inch SiC, 4inch SiC, 6inch SiC, 8inch SiC, 12inch SiC, 4H-N, 4H-SEMI, 6H-N, HPSI type


Character of 4H-N SiC4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer 0

- use SIC Monocrystal to make

 

- support customized ones with design artwork

 

- high performance, Wide Bandgap, High Electron Mobility

 

- High Hardness, about 9.2 Mohs

 

- widely used in high-tech areas, like power electronics, LEDs and sensors

 

Silicon carbide (SiC) wafers, composed of silicon and carbon, are a crucial semiconductor material utilized in various applications.

Known for their distinctive electrical and thermal properties, SiC wafers play an essential role in the semiconductor industry.

They are especially advantageous in high-temperature environments and offer several benefits over conventional silicon wafers.

*Product specification sheet is below.

Property P grade D grade
Crystal Form 4H-N
Polytype None Permitted Area≤5%
(MPD)a ≤1/cm2 ≤5/cm2
Hex Plates None Permitted Area≤5%
Hexagonal Polycrystal None Permitted
Inclusions Area≤0.05% N/A
Resistivity 0.015Ω•cm—0.028Ω•cm 0.014Ω•cm—0.028Ω•cm
(EPD)a ≤8000/cm2 N/A
(TED)a ≤6000/cm2 N/A
(BPD)a ≤2000/cm2 N/A
(TSD)a ≤1000/cm2 N/A
Stacking Fault ≤1% Area N/A
Surface Metal Contamination (Al, Cr, Fe, Ni, Cu, Zn, Pb, Na, K, Ti, Ca, V, Mn) ≤1E11cm-2

 

More details of 4H-N SiC

The silicon carbide (SiC) industrial chain consists of several key stages: substrate material preparation, epitaxial layer growth, device manufacturing, and downstream applications.

SiC monocrystals are typically produced using the physical vapour transmission (PVT) method.

These crystals then serve as substrates for the chemical vapour deposition (CVD) process, which creates epitaxial layers.

These layers are subsequently used to manufacture various devices.

In the SiC device industry, the majority of the value is concentrated in the upstream substrate manufacturing stage due to its technical complexity.

 

ZMSH company offers SiC wafers in sizes 2inch, 4inch, 6inch, 8inch and 12inch.

Due to its exceptional hardness (SiC is the second hardest material globally) and stability under high temperatures and voltage,

SiC is extensively utilized across multiple industries.

 

Samples

4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer 1

*As well, we can customize if you have further requirements.

 

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4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer 2

 

2.6" High Purity Silicon 4H-Semi SIC Dummy Grade Semiconductor Wafers LED 5G D Grade

4H-N Silicon Carbide SiC Substrate 8 inch Thickness 350um 500um P grade D grade SiC wafer 3

 

FAQ

1. Q: How does 4H-N SiC compare to silicon?

     A: 4H-N SiC has a wider bandgap, higher thermal conductivity, and better breakdown voltage compared to silicon.

 

2. Q: What is the future outlook for 4H-N SiC technology?

     A: The future outlook for 4H-N SiC technology is promising, with increasing demand in power electronics, renewable energy, and advanced electronic systems.

 

 

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