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| 브랜드 이름: | ZMSH |
| MOQ: | 100 |
| 배달 시간: | 2~4주 |
| 지불 조건: | 티/티 |
The Diamond-Aluminum Thermal Conductive Composite is a high-performance thermal management material that combines the exceptionally high thermal conductivity of diamond with a lightweight and rigid aluminum matrix. This composite offers an excellent balance of high heat dissipation efficiency, low density, low coefficient of thermal expansion (CTE), and strong mechanical performance, making it well suited for applications exposed to vibration, thermal cycling, and harsh operating environments.
By leveraging aluminum’s low density and good processability, diamond-aluminum composites provide a lightweight alternative to copper-based thermal solutions while maintaining superior thermal performance and structural stability.
High Thermal Conductivity: Thermal conductivity exceeding 600 W/m·K, enabling efficient heat spreading
Low Density: Density of approximately 3.0 g/cm³, significantly reducing overall system weight
Low Coefficient of Thermal Expansion: CTE below 6.5 ppm/K, improving compatibility with semiconductor devices
High Mechanical Strength: Flexural strength above 300 MPa, suitable for high-vibration environments
Excellent Thermal Stability: Maintains performance after 1000 thermal shock cycles from –65°C to 150°C
Good Surface Quality: Low surface roughness and high flatness support precision assembly
| Parameter | Unit | Value | Test Method |
|---|---|---|---|
| Thickness | mm | >0.5 | ASTM B311 |
| Density | g/cm³ | 3.0 | ASTM B311 |
| Surface Roughness | µm | <0.5 | ASTM D7363 |
| Parallelism | mm | <0.02 | ASTM A370 |
| Flexural Strength | MPa | >300 | ASTM E1461 |
| Thermal Conductivity | W/m·K | >600 | ASTM E1461 |
| Coefficient of Thermal Expansion (CTE) | ppm/K | <6.5 | ASTM E831 |
| Thermal Stability | °C | –65 to 150, 1000 cycles, <5% degradation | — |
Aerospace & Defense
Suitable for avionics, radar systems, and structural thermal management components where weight reduction and thermal reliability are critical
New Energy Vehicles
Applied in power modules, inverters, and battery thermal management systems to improve efficiency and durability
Data Centers & High-Performance Computing
Used in high-power processors and cooling modules requiring efficient heat dissipation with reduced structural load
Diamond-aluminum composites can be customized in terms of thickness, thermal conductivity, and CTE to meet specific application requirements. Precision machining and surface finishing are supported to ensure compatibility with advanced packaging and assembly processes.
Diamond-aluminum composites provide high thermal conductivity (>600 W/m·K) while offering a much lower density (~3.0 g/cm³) compared to copper-based materials. This makes them especially suitable for weight-sensitive applications such as aerospace, defense systems, and electric vehicles, where efficient heat dissipation and structural weight reduction are both critical.
With a CTE below 6.5 ppm/K, diamond-aluminum composites closely match the thermal expansion of semiconductor chips and ceramic substrates. This reduces thermal stress, warpage, and fatigue at solder or bonding interfaces, improving reliability under temperature cycling and vibration conditions.
Yes. The material maintains stable performance after 1000 thermal shock cycles from –65°C to 150°C, with less than 5% degradation in properties. Combined with its high mechanical strength (>300 MPa) and rigid aluminum matrix, it is well suited for high-vibration and harsh thermal environments commonly found in aerospace, defense, and new energy systems.
