제품 상세정보
Place of Origin: CHINA
브랜드 이름: ZMSH
인증: rohs
Model Number: 4 Inch Quartz Wafer
지불 및 배송 조건
Minimum Order Quantity: 10
가격: by case
Packaging Details: Package in 100-grade cleaning room
Delivery Time: 5-8weeks
Payment Terms: T/T
Supply Ability: 1000pcs per month
Diameter: |
4 inch (100mm) |
Thickness Range: |
0.5mm~1.5mm |
Surface Roughness (Polished): |
≤0.5nm |
Transmittance @193nm: |
>93% |
CTE (20-300°C): |
0.55×10⁻⁶/°C |
Parallelism: |
≤3μm |
Diameter: |
4 inch (100mm) |
Thickness Range: |
0.5mm~1.5mm |
Surface Roughness (Polished): |
≤0.5nm |
Transmittance @193nm: |
>93% |
CTE (20-300°C): |
0.55×10⁻⁶/°C |
Parallelism: |
≤3μm |
The 4-inch quartz wafer (100mm) is a large-format, ultra-high-purity fused silica substrate designed for high-precision, high-stability applications in semiconductors, optoelectronics, and advanced optics. Compared to 3-inch wafers, the 4-inch specification offers significantly greater usable area, improving production efficiency—particularly for batch manufacturing of IC photomasks, high-power laser optics, and MEMS sensors.
ZMSH specializes in the R&D and production of 4-inch and larger quartz wafers, offering:
- Full-size customization: Supports 4-inch, 6-inch, and 8-inch wafers, with non-standard sizes (e.g., square, sector-shaped) available.
- High-precision processing: Includes double-side ultra-polishing (Ra≤0.5nm), laser dicing (±0.01mm tolerance), and micro-hole/special-shaped via drilling.
- Functional treatments: Anti-reflective (AR) coatings, IR anti-reflection, diamond-like carbon (DLC) coatings, and more.
- Industry-grade solutions: Semiconductor-level cleanliness (Class 10), low defect density (≤0.1/cm²), ideal for EUV lithography and quantum computing.
| Technical Term | Specification |
| Diameter | 4 inch (100mm) |
| Thickness Range | 0.5mm~1.5mm |
| Surface Roughness (Polished) | ≤0.5nm |
| Transmittance @193nm | >93% |
| CTE (20-300°C) | 0.55×10⁻⁶/°C |
| Parallelism | ≤3μm |
| Vacuum Compatibility | 10⁻¹⁰ Torr |
1. Large-size precision: TTV≤10μm at 100mm diameter ensures process uniformity.
2. Ultra-low CTE: 0.55×10⁻⁶/°C, suitable for high-temperature processes (e.g., annealing, ion implantation).
3. Broadband transparency: >93% transmittance @193nm (DUV), >90% @3-5μm (IR).
4. Superior surface quality: Double-side polished with Ra≤0.5nm for nanoscale lithography.
5. Enhanced durability: Optional chemical strengthening boosts flexural strength to 600MPa; plasma-resistant.
| Field | Applications |
| Semiconductor | EUV lithography optics, photomask substrates, 3D NAND interposers |
| High-power Lasers | Laser mirrors, pulse compression gratings, fiber laser endcaps |
| Quantum Technology | Qubit chip carriers, cold atom trap viewports, single-photon detector substrates |
| Aerospace | Satellite lenses, radiation-resistant sensor windows, particle detectors |
| Biomedical | DNA sequencing chips, endoscope optics, microfluidic device molds |
ZMSH provides end-to-end customization for 4-inch quartz wafers, including:
- Material selection: JGS1/JGS2 UV-grade or IR-grade fused silica.
- Precision machining: Nanoscale polishing (λ/20), laser microstructuring (±1μm accuracy).
- Functional coatings: AR (193-1064nm), high-LIDT laser coatings (>5J/cm²).
- QA support: Full inspection reports (AOI, interferometry).
1. Q: What is the typical thickness tolerance for 4-inch quartz wafers?
A: Standard 4-inch (100mm) quartz wafers maintain ±0.02mm thickness tolerance across the 0.5-1.5mm range, ensuring uniformity for semiconductor lithography processes.
2. Q: Why choose 4-inch over 6-inch quartz wafers for MEMS applications?
A: 4-inch wafers provide optimal cost-efficiency for small-to-medium MEMS production runs while maintaining better process control than smaller diameters.
Tag: #3 Inch Quartz Substrate, #Customized, #Fused Silica Plates, #SiO₂ Crystal, #Quartz wafers, #JGS1/JGS2 Grade, # High-Purity, #Fused Silica Optical Components, #Quartz Glass Plate, #Custom-Shaped Through-Holes, #4Inch Quartz Wafer, #Diameter 100mm, #Semiconductor Manufacturing
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